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NASSCOM : Emerging multi-dimensional telecoms, media and IT marketplace - HYDERABAD

imran's picture
Submitted by imran on Wed, 12/03/2008 - 13:53.
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19/03/2008 - 11:30
19/03/2008 - 14:00
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19th March 2008, Hyderabad

NASSCOM is pleased to arrange a talk on ‘Emerging multi-dimensional telecoms, media and IT marketplace’ by Chris Lewis, Sr Vice President, Telecoms Research, Ovum on 19th March 2008 at ITC Kakatiya, Hyderabad.

Who Should Attend

Job Roles:

  • CEO, CTO, CIO, CMO
  • Business Development Executives
  • Domain specialists in telecom, media & entertainment

Industries:

  • IT companies (particularly their telecom, media & entertainment groups)
  • Telecom companies, Media & entertainment companies


Program


Time Activity
1130 - 1200 hrs Registration
1200 - 1205 hrs Welcome Address by Col. S V Ramachandran, Regional Director, NASSCOM
1205 - 1315 hrs

Presentation by Chris Lewis, Sr Vice President, Telecoms Research, Ovum

1315 - 1330 hrs Q & A
1330 hrs onwards Networking


Date & Venue

11:30 AM To 2:00 PM
19 March, 2008
Hyder Mahal, Hotel ITC Kakatiya, Begumpet
Hyderabad

Speaker Profile

Chris Lewis, Sr Vice President, Telecoms Research, Ovum


Chris Lewis is responsible for Ovum's global telecom research activities. In this role he brings together research covering the full spectrum of fixed and mobile services for business, consumer and wholesale markets, the regulatory environment, network infrastructure and service platforms.
Chris has spent the last 23 years working in the ICT industry. He has worked across the full spectrum of telecoms equipment and services, including consumer, enterprise networking and carrier services, as well as IT and applications issues. This has been on both an advisory service and consulting basis for clients at all points on the supply and demand side. Prior to working for Ovum, Chris worked for IDC, Logica and the Yankee Group.

Registration


Email to Ms. Shruti Verma at hyderabad@nasscom.in with the following details:

  • Name:
  • Designation:
  • Company:
  • Mobile:
  • Email:


For further details, please Click Here